Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal
Supported features in Simcenter 3D Thermal/Flow, Space Systems Thermal, and Electronic Systems Cooling solutions
The following tables list the features that are supported in Simcenter 3D Thermal/Flow, Space Systems Thermal (SST), and Electronic Systems Cooling (ESC). The Mapping solution is available for all three solvers. Some features are visible in the user interface (UI), but are not supported by a solution. If you create these features, they are not written to the scratch XML file. These unsupported but visible features are marked with an NA in the tables. The abbreviations Adv. and Axi. are used for Advanced and Axisymmetric, respectively.
Supported FEM commands
| Solver type | Thermal/Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| 3D Hybrid MeshNOTE | X | X | X | X | X | X | X | X | X | X | X | |||
| Auto Refinement ConstraintNOTE | X | X | X | X | X | X | X | X | X | X | X | |||
| Boundary Layer mesh controlNOTE | X | X | X | X | X | X | X | X | X | X | X | |||
| Contact Prevention ConstraintNOTE | X | X | X | X | X | X | X | X | X | X | X | |||
| Local Resolution ConstraintNOTE | X | X | X | X | X | X | X | X | X | X | X | |||
| Primitive | X | |||||||||||||
| Surface Wrap RecipeNOTE | X | X | X | X | X | X | X | X | X | X | X |
Supported mesh collectors
| Solver type | Thermal and Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| Concentrated Mass | X | X | X | X | X | X | X | X | X | |||||
| Beam | X | X | X | X | X | X | X | X | X | |||||
| Duct | NA | X | NA | X | NA | X | X | X | X | NA | X | |||
| Shell | X | X | X | X | X | X | X | X | X | X | X | X | X | X |
| Solid | X | X | X | X | X | X | X | X | X | X | X |
Supported physical property tables
| Solver type | Thermal and Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| Concentrated Mass | X | X | X | X | X | X | X | X | ||||||
| Beam | X | X | X | X | X | X | X | X | ||||||
| Duct | NA | X | NA | X | NA | X | X | X | X | NA | X | |||
| Thin Shell | X | X | X | X | X | X | X | X | X | X | ||||
| Multi-Layer Shell Uniform | X | X | X | X | X | X | X | X | ||||||
| Multi-Layer Shell Non-Uniform | X | X | X | X | X | X | X | X | ||||||
| PCB Stack | X | X | X | X | X | X |
Supported modeling objects
| Solver type | Thermal and Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| Ablation-Charring | NA | X | NA | X | X | NA | X | X | NA | X | ||||
| Active Heater Controller | NA | X | NA | X | X | NA | X | X | X | X | ||||
| Convection Properties | X | X | X | X | X | X | X | |||||||
| Duct Convection Correction | NA | X | NA | X | NA | X | X | X | NA | X | ||||
| Duct Head Loss | NA | X | NA | X | NA | X | X | X | NA | X | ||||
| External Conditions | X | X | X | X | X | X | X | |||||||
| Fan Speed Controller | NA | X | NA | X | X | X | X | |||||||
| Flow Convergence - Absolute Pressure | X | X | X | X | X | X | X | |||||||
| Flow Convergence - Absolute Temperature | X | X | X | X | X | X | X | |||||||
| Flow Convergence - Enthalpy | X | X | X | X | X | X | X | |||||||
| Flow Convergence - U Velocity | X | X | X | X | X | X | X | |||||||
| Flow Convergence - Velocity Magnitude | X | X | X | X | X | X | X | |||||||
| Flow Convergence - Viscosity | X | X | X | X | X | X | X | |||||||
| Flow Convergence - V Velocity | X | X | X | X | X | X | X | |||||||
| Flow Convergence - W Velocity | X | X | X | X | X | X | X | |||||||
| Homogeneous Gas Mixture | NA | X | NA | X | X | NA | X | |||||||
| Immiscible Fluid Mixture | NA | X | NA | X | X | NA | X | |||||||
| Joint | NA | X | NA | X | X | X | NA | X | ||||||
| Joint – Orbital Tracker | NA | NA | X | X | ||||||||||
| Layer | X | X | X | X | X | X | X | X | ||||||
| Monte Carlo Settings | NA | X | NA | X | X | NA | X | X | NA | X | ||||
| Non-Geometric Element | X | X | X | X | X | X | X | X | X | X | ||||
| Non-Newtonian Fluid | NA | X | NA | X | X | NA | X | |||||||
| Orbit | NA | NA | X | X | ||||||||||
| Planar Head Loss | X | X | X | X | X | X | X | |||||||
| PCB LayerNOTE | X | X | X | X | X | X | ||||||||
| PCB ViaNOTE | X | X | X | X | X | X | ||||||||
| Target Temperature | X | X | X | X | X | X | X | X | X | X | ||||
| Target Temperature Change | X | X | X | X | X | X | X | X | X | X | ||||
| Thermo-Optical Properties | X | X | X | X | X | X | X | X | X | X | ||||
| Thermo-Optical Properties — Advanced | NA | X | NA | X | X | NA | X | X | NA | X | ||||
| Thermo-Optical Properties — State | NA | X | NA | X | X | NA | X | X | ||||||
| Thermostat | X | X | X | X | X | X | X | X | X | X | X | X | ||
| Tracer Fluid | NA | X | NA | X | X | NA | X | |||||||
| Turbulent Characteristics | X | X | X | X | X | X | X | X |
Supported simulation objects
| Solver type | Thermal and Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| Advanced Controls | X | X | X | X | X | X | X | X | X | X | X | X | ||
| Deactivation Set | X | X | X | X | X | |||||||||
| Deactivation Set Advanced | X | X | X | X | X | X | X | |||||||
| Disjoint Fluid Mesh Pairing | X | X | X | X | ||||||||||
| Duct Flow Boundary Conditions | X | XNOTE | X | X | XNOTE | XNOTE | ||||||||
| Flow Blockage | X | X | X | X | X | X | X | |||||||
| Flow Boundary Condition | XNOTE | X | XNOTE | X | X | X | X | |||||||
| Flow Convergence | X | X | X | X | X | X | X | |||||||
| Flow Surface | X | X | X | X | X | X | X | |||||||
| Fluid DomainNOTE | X | X | X | X | X | X | X | |||||||
| Free Molecular Heating | X | X | ||||||||||||
| Immersed Ducts | X | X | X | X | X | |||||||||
| Interface Resistance | X | X | X | X | X | X NOTE | X NOTE | X | X | X | ||||
| Joule Heating | X | X | X | X | X | X | ||||||||
| Merge Set | X | X | ||||||||||||
| Mixing Plane | X | X | X | X | ||||||||||
| Moving Frame of Reference | X | X | X | X | ||||||||||
| Orbital Heating | X | X | ||||||||||||
| Override Set – Thermal Properties | X NOTE | X | X NOTE | X | X | X | X NOTE | X | ||||||
| PCB Component | X | X | X | X | ||||||||||
| Particle Injection | X | X | X | X | ||||||||||
| Peltier Cooler | X | X | X | X | X | X | ||||||||
| Periodic Boundary Condition | X | X | X | X | ||||||||||
| Printed Circuit Board | X | X | X | X | ||||||||||
| Protective Layers | X | X | X | X | ||||||||||
| Radiation | X | X | X | X | X | X | X | X | X | X | ||||
| Radiative Element Subdivision | X | X | X | X | X | |||||||||
| Radiative Heating | X | X | X | X | X | X | ||||||||
| Report | XNOTE | XNOTE | XNOTE | XNOTE | X | X | X | XNOTE | XNOTE | XNOTE | XNOTE | X | ||
| Screen | X | X | X | X | X | X | X | |||||||
| Selective Results | X | X | X | X | X | X | X | |||||||
| Solar Heating | X | X | X | |||||||||||
| Solar Heating Space | X | X | ||||||||||||
| Solid Motion Effects | X | X | X | X | X | |||||||||
| Supersonic Inlet | X | X | X | X | ||||||||||
| Surface-to-Surface Contact | X | X | X | X | X | X | X | X | ||||||
| Symmetry Plane | X | X | X | X | X | X | X | |||||||
| Thermal Coupling | X | X | X | X | X | X | X | X | X | X | ||||
| Thermal Coupling – Advanced | X | X | X | X | X | X | ||||||||
| Thermal Coupling – Convection | X | X | X | X | X | X | ||||||||
| Thermal Coupling – Radiation | X | X | X | X | X | X | X | X | X | X | ||||
| Thermal Rotational Periodicity | X | X | X | X | X | |||||||||
| Thermal Streams Junction | X | X | X | X |
Supported loads
| Solver type | Thermal and Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| Rotation | X | X | X | X | ||||||||||
| Thermal Convecting Zone | X | X | X | X | ||||||||||
| Thermal Loads | X | X | X | X | X | X | X | X | X | X | X | X | ||
| Thermal Stream | X | X | X | X | ||||||||||
| Thermal Void | X | X | X | X |
Supported constraints
| Solver type | Thermal and Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| Axisymmetry Target Zone | X | |||||||||||||
| Convection to Environment | X | X | X | X | X | X | X | X | X | X | ||||
| Film Cooling | X | X | X | X | ||||||||||
| Flow Target Zone | X | |||||||||||||
| Initial Conditions | XNOTE | XNOTE | XNOTE | X | XNOTE | X | X | XNOTE | XNOTE | XNOTE | XNOTE | X | ||
| Mapping | XNOTE | XNOTE | XNOTE | XNOTE | X | X | X | XNOTE | XNOTE | XNOTE | X | X | ||
| Mapping Target Set | X | X | ||||||||||||
| Simple Radiation to Environment | X | X | X | X | X | X | X | X | X | X | ||||
| Rotational Periodicity Target Zone | X | |||||||||||||
| Temperature | X | X | X | X | X | X | X | X | X | X | X | X | ||
| Thermal Target Zone | X | X | ||||||||||||
| Transverse Gradient Target Zone | X |
Supported solution attributes and parameters
| Solver type | Thermal and Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| Advanced Parameter Catalog | X | X | X | X | X | X | X | X | X | X | X | X | ||
| Buoyancy | X | X | X | X | X | X | X | |||||||
| Component Catalog | X | X | X | |||||||||||
| Condensation/Evaporation | X | X | X | X | ||||||||||
| Correction Catalog | NA | X | NA | X | NA | X | X | X | X | X | ||||
| Fan Catalog | X | X | ||||||||||||
| Fan Curves | X | X | X | X | X | X | X | |||||||
| Humidity | X | X | X | X | ||||||||||
| Multithreading | X | X | X | X | X | X | ||||||||
| Parallel ProcessingNOTE | XNOTE | XNOTE | XNOTE | XNOTE | XNOTE | XNOTE | XNOTE | XNOTE | ||||||
| Thermal Phase Change | X | X | X | X | X | X | X | X | X | X | ||||
| Turbulence Model | XNOTE | X | XNOTE | X | X | XNOTE | X | |||||||
| Plugin functions in expressions | X | X | X | X | ||||||||||
| User-written subroutines | X | X | X | X | X | X | ||||||||
| Flow API | X | X | X | X | X |
Supported simulation file types for import
| Solver type | Thermal and Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| CGNSNOTE | X | X | X | X | X | X | X | |||||||
| I-DEAS Universal | X | X | X | X | X | X | X | X | X | X | ||||
| PLOT3D | X | X | X | X | X | X | X | |||||||
| Radiation Model Primitives | X | |||||||||||||
| Simcenter 3D Thermal/Flow Solver Input | X | X | X | X | X | X | X | X | X | X | ||||
| Solution Error/Warning Groups | X | X | X | X | X | X | X | X | X | X | ||||
| TMG/ESC Scratch File | X | X | X | X | X | X | X | X | X | X | ||||
| TMG INPF | X | X | X | X | X | X | X | X | X | X |
Supported simulation file types for export
| Solver type | Thermal and Flow | SST | ESC | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Solution type | Thermal | Adv. Thermal | Flow | Adv. Flow | Thermal-Flow | Adv. Thermal-Flow | Complete | Axi. Thermal | Adv. Axi. Thermal | Mapping | Axi. Mapping | SST | ESC | Adv. ESC |
| CGNSNOTE | X | X | X | X | X | X | X | |||||||
| ESATAN | X | |||||||||||||
| Mapping Constraint File | X | X | X | X | X | X | X | X | X | X | ||||
| Radiation Model Primitives | X | |||||||||||||
| SINDA-85 | X | |||||||||||||
| TMG INPF | X | X | X | X | X | X | X | X | X | X |
Learn more
Simcenter 3D Thermal/Flow
Simcenter 3D Electronic Systems Cooling
Simcenter 3D Space Systems Thermal
Thermal solver features
Flow solver features
Look up more details
Customizing catalogs
Thermal and flow solver reference manuals
Quick links
Command reference
Pre/Post video examples
Bulk Entry Descriptions
Simcenter 3D tutorials
Browse Simcenter 3D help by product area
Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions
Supported features in Simcenter 3D Thermal/Flow, Space Systems Thermal, and Electronic Systems Cooling solutions, Simcenter 3D 2021.1 Series
© 2020 Siemens
Requires a license of Advanced Fluid Modeling.
Requires a license of Advanced Fluid Modeling.
Requires a license of Advanced Fluid Modeling.
Requires a license of Advanced Fluid Modeling.
Requires a license of Advanced Fluid Modeling.
Requires a license of Advanced Fluid Modeling.
Only accessible from the
PCB Stack
physical property table.
Only accessible from the
PCB Stack
physical property table.
The
One-Sided Total Temperature Effects
and
Two-Sided Total Temperature Effects
type of
Duct Flow Boundary Condition
simulation object are only supported for thermal solutions.
The
One-Sided Total Temperature Effects
and
Two-Sided Total Temperature Effects
type of
Duct Flow Boundary Condition
simulation object are only supported in the Thermal/Flow solver environment.
The
One-Sided Total Temperature Effects
and
Two-Sided Total Temperature Effects
type of
Duct Flow Boundary Condition
simulation object are only supported in the Thermal/Flow solver environment.
The
Bursting Membrane
and
Flap
types of
Flow Boundary Condition
simulation object is visible in the UI, but is not supported in
Flow
and
Thermal-Flow
solution types.
The
Bursting Membrane
and
Flap
types of
Flow Boundary Condition
simulation object is visible in the UI, but is not supported in
Flow
and
Thermal-Flow
solution types.
Requires a license of Advanced Fluid Modeling.
Only the
Surface Interface
type of
Interface Resistance
simulation object is supported in the
Axisymmetric Thermal
and
Advanced Axisymmetric Thermal
solution types.
Only the
Surface Interface
type of
Interface Resistance
simulation object is supported in the
Axisymmetric Thermal
and
Advanced Axisymmetric Thermal
solution types.
The
Solar Absorptivity
type of
Override Set – Thermal Properties
simulation object is visible in the UI, but is not supported in
Thermal
,
Thermal-Flow
, and
Electronic Systems Cooling
solution types.
The
Solar Absorptivity
type of
Override Set – Thermal Properties
simulation object is visible in the UI, but is not supported in
Thermal
,
Thermal-Flow
, and
Electronic Systems Cooling
solution types.
The
Solar Absorptivity
type of
Override Set – Thermal Properties
simulation object is visible in the UI, but is not supported in
Thermal
,
Thermal-Flow
, and
Electronic Systems Cooling
solution types.
The
Lift and Drag
type of
Report
simulation object is not supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Electronic Systems Cooling
solution types.
The
Lift and Drag
type of
Report
simulation object is not supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Electronic Systems Cooling
solution types.
The
Per Element
and
Heat Maps
types of
Report
simulation objects are not supported in
Flow
and
Advanced Flow
solution types.
The
Per Element
and
Heat Maps
types of
Report
simulation objects are not supported in
Flow
and
Advanced Flow
solution types.
The
Lift and Drag
type of
Report
simulation object is not supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Electronic Systems Cooling
solution types.
The
Lift and Drag
type of
Report
simulation object is not supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Electronic Systems Cooling
solution types.
The
Space Systems Thermal
solution type only supports
Per Region
,
Track During Solve
, and
Heat Maps
types of
Report
simulation objects.
The
Lift and Drag
type of
Report
simulation object is not supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Electronic Systems Cooling
solution types.
Only the
Initial Temperature
type of
Initial Condition
constraint is supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Space Systems Thermal
solution types.
Only the
Initial Temperature
type of
Initial Condition
constraint is supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Space Systems Thermal
solution types.
Initial Humidity
,
Initial Tracer Fluid
,
Initial Mixture
, and
Initial Water Content
types of
Initial Condition
constraints are visible in the UI, but are not supported in
Flow
,
Thermal-Flow
, and
Electronic Systems Cooling
solution types.
Initial Humidity
,
Initial Tracer Fluid
,
Initial Mixture
, and
Initial Water Content
types of
Initial Condition
constraints are visible in the UI, but are not supported in
Flow
,
Thermal-Flow
, and
Electronic Systems Cooling
solution types.
Only the
Initial Temperature
type of
Initial Condition
constraint is supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Space Systems Thermal
solution types.
Only the
Initial Temperature
type of
Initial Condition
constraint is supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Space Systems Thermal
solution types.
Only the
Initial Temperature
type of
Initial Condition
constraint is supported in
Thermal
,
Advanced Thermal
,
Axisymmetric Thermal
,
Advanced Axisymmetric Thermal
, and
Space Systems Thermal
solution types.
Initial Humidity
,
Initial Tracer Fluid
,
Initial Mixture
, and
Initial Water Content
types of
Initial Condition
constraints are visible in the UI, but are not supported in
Flow
,
Thermal-Flow
, and
Electronic Systems Cooling
solution types.
The
Flow Association Zone
type of
Mapping
constraint is not supported in
Thermal
,
Advanced Thermal
, and
Space Systems Thermal
solution types.
The
Flow Association Zone
type of
Mapping
constraint is not supported in
Thermal
,
Advanced Thermal
, and
Space Systems Thermal
solution types.
Only the
Flow Association Zone
type of
Mapping
constraint is supported in
Flow
and
Advanced Flow
solution types.
Only the
Flow Association Zone
type of
Mapping
constraint is supported in
Flow
and
Advanced Flow
solution types.
Only
Thermal Association Zone
and
Exclude Elements
types of
Mapping
constraints are supported in
Axisymmetric Thermal
and
Advanced Axisymmetric Thermal
solution types.
Only
Thermal Association Zone
and
Exclude Elements
types of
Mapping
constraints are supported in
Axisymmetric Thermal
and
Advanced Axisymmetric Thermal
solution types.
The
Flow Association Zone
type of
Mapping
constraint is not supported in
Thermal
,
Advanced Thermal
, and
Space Systems Thermal
solution types.
If you have the Simcenter 3D Thermal/Flow DMP license, any software limitations on the number of solver processes per run for parallel processing is removed and you can perform an analysis in parallel with all solutions except
Mapping
.
Without the Simcenter 3D Thermal/Flow DMP license, you can only perform an analysis in parallel on a single workstation with access for up to 8 processes per run.
Without the Simcenter 3D Thermal/Flow DMP license, you can only perform an analysis in parallel on a single workstation with access for up to 8 processes per run.
Without the Simcenter 3D Thermal/Flow DMP license, you can only perform an analysis in parallel on a single workstation with access for up to 8 processes per run.
Without the Simcenter 3D Thermal/Flow DMP license, you can only perform an analysis in parallel on a single workstation with access for up to 8 processes per run.
Without the Simcenter 3D Thermal/Flow DMP license, you can only perform an analysis in parallel on a single workstation with access for up to 8 processes per run.
Without the Simcenter 3D Thermal/Flow DMP license, you can only perform an analysis in parallel on a single workstation with access for up to 8 processes per run.
Without the Simcenter 3D Thermal/Flow DMP license, you can only perform an analysis in parallel on a single workstation with access for up to 8 processes per run.
Without the Simcenter 3D Thermal/Flow DMP license, you can only perform an analysis in parallel on a single workstation with access for up to 8 processes per run.
SST – Shear Stress Transport
,
K-Omega
, and
LES – Large Eddy Simulation
turbulence models are only supported for advanced licenses.
SST – Shear Stress Transport
,
K-Omega
, and
LES – Large Eddy Simulation
turbulence models are only supported for advanced licenses.
SST – Shear Stress Transport
,
K-Omega
, and
LES – Large Eddy Simulation
turbulence models are only supported for advanced licenses.
Requires a license of Advanced Fluid Modeling.
Requires a license of Advanced Fluid Modeling.
window.mainLanguage="en_US"
window.delivId=""
window.projectId=""
MathJax.Hub.Config({ TeX: { extensions: ["autoload-all.js"] }, tex2jax: { displayMath: [ ] }, "SVG": { scale: 125 } });
Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/id629666 · retrieved 2026-07-17