Command reference help topics
PCB Layer dialog box (Thermal/Flow/ESC/SST)
When you edit multiple PCB Layer modeling objects, the Multiple Edit PCB Layer dialog box opens, which lists the Properties group options and identifies each property's status. For more information, see Editing the attributes of multiple PCB layers and vias.
| Option | Description |
|---|---|
| Name | Sets the name of the PCB Layer modeling object. |
| Label | Assigns a label number to the modeling objects. You can use labels to organize modeling objects. |
| Properties | |
| Trace Material | Assigns a material to the conductive portion of the PCB layer.Select a material from the list, or click Choose material to define a new material. |
| Dielectric Material | Assigns a material to the insulating portion of the PCB layer.Select a material from the list, or click Choose material to define a new material. |
| Thickness | Specifies the thickness of the PCB layer. |
| Trace Coverage | Sets the percentage of the trace material coverage on the PCB layer. Type a value from 0 to 1.You can use a field to specify the location of conductive material in a plane. |
| Thermal Conductivity | Specifies the information source to calculate the orthotropic board conductivity.From Materials and Trace CoverageCalculates the board orthotropic conductivity from the surface area, Trace Coverage value, and the materials that you define.SpecifyLets you define a thermal conductivity spatial field that overwrites the Thickness and Trace Coverage values.The coverage percentage is ignored if you specify a conductivity field in kx, kx, kx, |
| Thermal Conductivity Override | Appears when Thermal Conductivity is set to Specify.Lets you define a thermal conductivity field to model orthotropic board conductivity. |
| Material Orientation | Appears when Thermal Conductivity is set to Specify.Lets you specify the coordinate system from which the Thermal Conductivity Override is calculated. |
Learn more
PCB Layer
PCB Stack
Editing the attributes of multiple PCB layers and vias
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Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal
Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions
PCB Layer dialog box (Thermal/Flow/ESC/SST), Simcenter 3D 2021.1 Series
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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/id1388799 · retrieved 2026-07-17