Create a printed circuit board stack

You must have an Electronic Systems Cooling FEM open.

1. Choose Home tab→Properties group→Physical Properties .

2. In the Physical Property Tables Manager dialog box, from the Type list select PCB Stack.

3. Click Create.

4. In the PCB Stack dialog box, click the Stack Definition tab.

5. Create as many PCB layers as you need. In the Create group, click Create.In the PCB Layer dialog box, in the Name box, type a relevant layer name.From the Trace Material list, select a material, or click Choose material and select or create a material that represents the traces.From the Dielectric Material list, select a material, or click Choose material and select or create a material that represents the insulation.In the Thickness box, enter the total thickness of the layer.In the Trace Coverage box, enter the percentage of trace material on the board.(Optional) Alternatively, you can define a field that describe the field distribution of the trace material. Click OK

6. Click the Vias Definition tab.

7. Create as many PCB vias as you need. In the Create group, click Create.In the Via Layer dialog box, in the Name box, type a relevant via name.From the From Layer list, select the top connecting layer across the board.From the To Layer list, select the bottom connecting layer across the board.From the Via Material list, select a material, or click Choose material and select or create a material that represents the via.In the Via Coverage box, enter the percentage of via material across the board.Alternatively, you can define a field that describe the field distribution of the via material. Click OK.

8. Click OK in the PCB Stack dialog box.

9. Click Close in the Physical Property Tables Manager.

Learn more

PCB Stack

PCB Layer

Editing the attributes of multiple PCB layers and vias

PCB Via

Printed Circuit Board

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Create a printed circuit board stack, Simcenter 3D 2021.1 Series

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