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PCB Via dialog box (Thermal/Flow/ESC/SST)

When you edit multiple PCB Via modeling objects, the Multiple Edit PCB Via dialog box opens, which lists the Properties group options and identifies each property's status. For more information, see Editing the attributes of multiple PCB layers and vias.

Option Description
Name Sets the name of the PCB Via modeling object.
Label Assigns a label number to the modeling object. You can use labels to organize modeling object.
Properties
From Layer Specifies the layer from which the PCB via starts.
To Layer Specifies the layer from which the PCB via ends.All PCB layers that exist between From Layer and To Layer selections are connected by the via.
Via Material Assigns a material to the via.Select a material from the list, or click Choose material to define a new material.
Via Coverage Specifies the type of method used to calculate the via distribution on the board.Expression sets the percentage of the board area that is covered with conductive material across PCB layers. Type a value from 0 to 1.Field lets you use a field to specify the location of conductive via material in a plane.
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PCB Via

PCB Stack

Editing the attributes of multiple PCB layers and vias

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Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal

Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions

PCB Via dialog box (Thermal/Flow/ESC/SST), Simcenter 3D 2021.1 Series

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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/id1388986 · retrieved 2026-07-17