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Meshing > Meshing for Simcenter 3D Thermal/Flow, Electronic Systems Cooling, Space Systems Thermal

Geometry preparation for immersed boundary method

The fluid material occupies the void between the solid bodies, not the bodies themselves. To model this fluid, you mesh the void between the solid bodies.

Electronics box

Closing the fluid domain

To generate an immersed boundary mesh, the software requires a fluid domain that is enclosed by solid or sheet bodies. The enclosure does not need to be airtight provided that the specified boundary cell size is larger than the hole or gap size.

You need to create sheet or solid bodies for regions where the fluid is entering or leaving the fluid domain.

Sheet bodies representing openings in the electronic box

Meshing the fluid domain boundary

You mesh all bodies and surfaces representing the boundary of the fluid domain with 2D and 3D elements. The software uses these meshes to automatically detect flow surfaces and specify flow boundary conditions. The mesh resolution resolves the geometric details of the fluid domain boundaries. The flow solver uses the immersed boundary mesh for numerical calculations. For coupled-thermal-flow solutions, these 2D and 3D solid elements require thermal material properties that the thermal solver uses for thermal calculations.

Meshed bodies representing the boundary of the fluid domain

How do I

Create a primitive

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Thermal meshing

Fluid meshing

Immersed boundary meshing

Duct network meshing

Primitives for Simcenter 3D Space Systems Thermal

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Meshing for Simcenter 3D Thermal/Flow, Electronic Systems Cooling, Space Systems Thermal

Special considerations for thermal meshing

Working with multi-layer shell elements

Geometry creation for body-fitted fluid meshing

Defining the mesh size for fluid modeling

Node to geometry matching in large dimension models

Meshing for turbulence modeling

Meshing consideration and wall functions

Thermal and flow element quality

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Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions

Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal

Geometry preparation for immersed boundary method, Simcenter 3D 2021.1 Series

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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/xid1688969 · retrieved 2026-07-17