Meshing > Meshing for Simcenter 3D Thermal/Flow, Electronic Systems Cooling, Space Systems Thermal
Geometry preparation for immersed boundary method
The fluid material occupies the void between the solid bodies, not the bodies themselves. To model this fluid, you mesh the void between the solid bodies.
Electronics box
Closing the fluid domain
To generate an immersed boundary mesh, the software requires a fluid domain that is enclosed by solid or sheet bodies. The enclosure does not need to be airtight provided that the specified boundary cell size is larger than the hole or gap size.
You need to create sheet or solid bodies for regions where the fluid is entering or leaving the fluid domain.
Sheet bodies representing openings in the electronic box
Meshing the fluid domain boundary
You mesh all bodies and surfaces representing the boundary of the fluid domain with 2D and 3D elements. The software uses these meshes to automatically detect flow surfaces and specify flow boundary conditions. The mesh resolution resolves the geometric details of the fluid domain boundaries. The flow solver uses the immersed boundary mesh for numerical calculations. For coupled-thermal-flow solutions, these 2D and 3D solid elements require thermal material properties that the thermal solver uses for thermal calculations.
Meshed bodies representing the boundary of the fluid domain
How do I
Create a primitive
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Thermal meshing
Fluid meshing
Immersed boundary meshing
Duct network meshing
Primitives for Simcenter 3D Space Systems Thermal
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Meshing for Simcenter 3D Thermal/Flow, Electronic Systems Cooling, Space Systems Thermal
Special considerations for thermal meshing
Working with multi-layer shell elements
Geometry creation for body-fitted fluid meshing
Defining the mesh size for fluid modeling
Node to geometry matching in large dimension models
Meshing for turbulence modeling
Meshing consideration and wall functions
Thermal and flow element quality
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Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions
Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal
Geometry preparation for immersed boundary method, Simcenter 3D 2021.1 Series
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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/xid1688969 · retrieved 2026-07-17