Model a BGA contact using a Thermal Coupling

You can easily model the heat transfer between the solder balls of a BGA, ball grid array, chip and a PCB.

1. When you define the Thermal Coupling simulation object, select Heat Transfer Coefficient from the Type list. Specify the total heat transfer coefficient as:h = ksolder balls Atotal (solder balls) / Lgap ABGA

2. Ensure that the selected faces as the primary areas and secondary areas reflect the distribution of the solder ball array.

The conductance is calculated as G = h*ABGA.

In the figure, the bottom face of the BGA is selected as primary area, and the PCB is selected as the secondary area.

	(A) Chip(B) PCB(C) Solder balls from BGA(D) Gap

Using a Thermal Coupling to model a BGA contact

How do I

Create a thermal coupling

Model conduction in a bonded joint

Model conduction across a card edge guide

Model additional thermal resistance in a bolted joint

Create a perfect contact thermal coupling

Learn more

Thermal Coupling magnitude types

Additional Conductance types

Specifying a Coupling Resolution

Using the Only Connect Overlapping Elements option

Using the Overlap Projection Direction option

Temperature dependency for thermal and electrical couplings

Inputs to expressions

Look up more details

Thermal cyclic symmetry using perfect contact thermal coupling

Perfect Contact options

Auto-generated expressions

Thermal Coupling dialog box

Quick links

Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions

Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal

Command reference

Pre/Post video examples

Bulk Entry Descriptions

Simcenter 3D tutorials

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Model a BGA contact using a Thermal Coupling, Simcenter 3D 2021.1 Series

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