Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal > Solving the model > Solution Monitor
Solution Information window
For transient analysis, you can monitor analysis information from the Solution Information window, that is accessed from Solution Monitor window.
The Solution Information window provides the following information:
General
Simulation time.
Temperature residuals of surfaces that are in contact with the fluid.
Convected heat residuals between the solid surfaces that are in contact with the fluid.
Thermal Solver
Heat that is convected from the fluid to the solid and vice versa.
Heat flow into and from boundary conditions.
Maximum and minimum temperatures in the solid part of the model.
Total heat load on the model from the following boundary conditions: heat loads, heat fluxes, and heat generation.
Percentage of the thermal solver energy imbalance.
Flow Solver
- Percentage of the mass, momentum, and energy equation imbalances.
How do I
Create or modify a solution
Learn more
Track During Solve report
Look up more details
Graphs in the Solution Monitor
Flow convergence graphs
Thermal convergence graphs
Coupled thermal flow convergence graphs
Fan curves graph
Track Results — Full Model and Report Graphs
Solution Monitor dialog box(Thermal/Flow/SST/ESC/Multiphysics/Simcenter Nastran/Samcef)
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Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions
Solution Information window, Simcenter 3D 2021.1 Series
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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/id1456167 · retrieved 2026-07-17