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Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal > Solving the model > Solution Monitor

Solution Information window

For transient analysis, you can monitor analysis information from the Solution Information window, that is accessed from Solution Monitor window.

The Solution Information window provides the following information:

General
  • Simulation time.

  • Temperature residuals of surfaces that are in contact with the fluid.

  • Convected heat residuals between the solid surfaces that are in contact with the fluid.

Thermal Solver
  • Heat that is convected from the fluid to the solid and vice versa.

  • Heat flow into and from boundary conditions.

  • Maximum and minimum temperatures in the solid part of the model.

  • Total heat load on the model from the following boundary conditions: heat loads, heat fluxes, and heat generation.

  • Percentage of the thermal solver energy imbalance.

Flow Solver
  • Percentage of the mass, momentum, and energy equation imbalances.
How do I

Create or modify a solution

Learn more

Track During Solve report

Look up more details

Graphs in the Solution Monitor

Flow convergence graphs

Thermal convergence graphs

Coupled thermal flow convergence graphs

Fan curves graph

Track Results — Full Model and Report Graphs

Solution Monitor dialog box(Thermal/Flow/SST/ESC/Multiphysics/Simcenter Nastran/Samcef)

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Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions

Solution Information window, Simcenter 3D 2021.1 Series

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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/id1456167 · retrieved 2026-07-17