Command reference help topics
PCB Component dialog box
Use this dialog box to set options for the PCB Component simulation object for the Simcenter 3D Electronic Systems Cooling and Space Systems Thermal solvers.
| Name | |
|---|---|
| Name | Sets a name for the PCB component. The name is automatically set to the Reference Designator attribute when the PCB Component simulation object is created automatically by PCB Exchange. |
| Description | Specifies a description for the component. |
| Destination Folder | |
| Simulation Object Container | Specifies the folder in the Simulation Navigator in which the boundary condition will be stored.The list includes the root container and existing folders that you created using the New Folder command. Examples of a root container include Load Container, Constraint Container, and Simulation Object Container. |
| Folder Manager | Displays a hierarchical listing of existing folders.To create a new folder, right-click any level of the hierarchy and choose New Folder. |
| Component Region | |
| Select Object | Lets you select a face or 2D elements that represent the component. You must select the most geometrically representative meshed face (1) furthest from the board (2).Excluded lets you remove individual entities from within your selected object. |
| Stacked Smart Selector Methods | Opens the Smart Selector Methods dialog box where you can specify a progression of smart selection filters.For more information, see Smart Selector Methods dialog box. |
| Mounting Region | |
| Mounting Region | Lets you select a mounting region from the list, or click Create Region to create a new region. After you select a region, use Edit to modify it.See Region dialog boxA PCB mounting region is selected when the PCB Component simulation object is automatically created by PCB Exchange. |
| Component Model | |
| Component Catalog | Opens the Component Catalog dialog box. You can select a pre-existing component that has a thermal model defined. |
| Model | Specifies the type of thermal model that is used as a Zero-Resistor, One-Resistor, or a Two-Resistor thermal model. |
| Model Parameters | |
| The thermal model values are automatically added when the PCB Component simulation object is created automatically by PCB Exchange. The default values are defined in the PCB Exchange Preferences dialog box or the Component Catalog dialog box. | |
| Tmax | Appears when Model is set to Zero-Resistor.Sets the maximum allowable temperature for the component. |
| Theta CB | Appears when Model is set to One-Resistor.Sets the resistance (C/W) between the component and the board. |
| Tmax Case | Appears when Model is set to One-Resistor or Two-Resistor.Sets the maximum allowable temperature for the component. |
| Theta JC | Appears when Model is set to Two-Resistor.Sets the resistance (C/W) between the component and the lump mass. |
| Theta JB | Appears when Model is set to Two-Resistor.Sets the resistance (C/W) between the lump mass and the board. |
| Tmax Junction | Appears when Model is set to Two-Resistor.Sets the maximum allowable temperature at the junction. |
| Dissipation | Sets a constant or time-varying value for the total load on the component. For more information, see Additional magnitude options. |
| Advanced Model Parameters | |
| Emissivity | Appears when Model is set to One-Resistor or Two-Resistor.Specifies the source of the emissivity value that is used.Use Thermo-Optical PropertiesUses the properties that you defined for the elements in the FEM file.Specify Lets you enter the emissivity of the component surface. |
| Emissivity Value | Appears when Emissivity is set to Specify.Sets the emissivity value that is used in the calculation of radiative heat exchange. |
| Junction Capacitance | Appears when Model is set to Two-Resistor.Defines the capacitance of the lump mass. |
| Description | |
| These values are automatically added when the PCB Component simulation object is created automatically by PCB Exchange. | |
| Part Number | Specifies the part number used in the ECAD or MCAD model to describe its unique identifier. |
| Package | Describes the geometric part file used in the ECAD or MCAD model. |
| Manufacturer | Describes the part manufacturer. |
| Additional Parameters | |
| Compute Single Footprint/Case Temperature | Creates a copy of the Component Region mesh half way between it and the Mounting Region mesh, connecting the model internally to provide a single temperature result from the component. It averages the results of the Component Region elements by merging them together. |
| Coupling Resolution | Specifies the accuracy of the coupling. The software subdivides component region elements according to the specified Coupling Resolution option before it determines conductances. With the One to One resolution, the solver calculates a single conductance from each component region element to the nearest mounting element.With the Coarse through Finest resolutions, the software subdivides each component region element into a progressively larger number of sub-elements.A finer subdivision level does not necessarily produce more accurate results. |
| Reports | |
| Temperature Report | Creates an HTML temperature report. |
| Track During Solve | Displays the temperature during the solution in the Solution Monitor. |
Learn more
PCB Component
Specifying a Coupling Resolution
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Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal
Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions
Related Topics
Component naming and numbering
Component mesh creation and coupling
PCB Component dialog box, Simcenter 3D 2021.1 Series
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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/id1388258 · retrieved 2026-07-17