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Create a test analysis reference solution from a pre-test solution process

This example shows how to create a test analysis reference solution from the pre-test solution process, using the automatic method for creating a wireframe.

Note:

You can also create a test analysis reference solution using the manual method. For more information, see steps 5 and 6 in Create a test analysis reference solution from a correlation solution process.

  1. Choose Correlation tab→Pre-Test Planning group→Test Analysis Reference Solution .

  2. (Optional) Give a meaningful name to the test analysis reference solution.

  3. In the Analysis Results Source group, from the Pre-Test Solution list, select one of the pre-test solution processes.The Source is automatically set to Pre-Test Solution, because you opened the command from the Pre-Test group.

  4. In the Pre-Test Solution Options group, from the Select Sensor Configuration list, select a sensor configuration from the pre-test solution process. For more information, see Create a new sensor selection configuration.

  5. From the Select Exciter Configuration list, select an exciter configuration from the pre-test solution process. For more information, see Create an exciter selection configuration.

  6. In the Wireframe group, from the Method list, select Automatic.

  7. In the Options group, in the Min Angle Between Wires box, set the minimum angle between the wires connected to a given node.

  8. In the Max Number of Wires per Node box, set the maximum number of wires that connect any node to the other nodes.

  9. In the Max Distance Ratio box, set the ratio of the distance between two connected nodes over the average distance of the six closest nodes.

  10. Select Preview check box to display the computed wireframe.

  11. Click OK.Note: In case of any conflicts between DOFs included in the selected sensor or exciter configuration, you can choose the configuration the solver uses to compute the DOFs.

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Create a test analysis reference solution from a correlation solution process

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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/xid1677294 · retrieved 2026-07-17