Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal
Simcenter 3D Thermal/Flow
The Simcenter 3D Thermal/Flow solver environment is a comprehensive heat transfer and flow simulation suite. Like Simcenter Nastran, it is fully integrated into the Pre/Post environment. Teamcenter tools are supported for controlling multiple design iterations and case studies.
Thermal/Flow solver environment
In the Simcenter 3D Thermal/Flow solver environment, the following analysis types are available:
Thermal
Flow
Coupled Thermal-Flow
Axisymmetric Thermal
Mapping
Axisymmetric Mapping
The Flow analysis type uses the flow solver to solve the Navier-Stokes equations for both steady state and transient Computational Fluid Dynamics (CFD) analysis.
Thermal and Axisymmetric Thermal use the thermal solver to solve steady state and transient heat transfer solutions.
Both the thermal and flow solvers are parallelized and you can have up to 8 processes per run, on a single machine. If you have the Thermal/Flow DMP add-on product, which removes any software limitations on the number of processes per run for parallel processing, you can run on more than 8 processes, as well as run parallel solutions over networks and clusters.
Coupled Thermal-Flow
The Coupled Thermal-Flow analysis type uses both the thermal and flow solvers. The thermal and flow solvers are automatically coupled for thermo-fluid multiphysics applications. You can run the two solvers separately or together. When you run the two solvers together, the combined solvers act as a third coupled solver that incorporates explicit convection modeling with all the modeling capabilities of both solvers. The coupled solver accurately simulates forced and natural convection by automatically calculating convection heat transfer using 3-layer log-law wall functions for turbulent flows and integration to the wall for laminar flows.
You can use the results as boundary conditions for thermal stress and deflection analysis with the Simcenter Nastran solver.
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Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions
Simcenter 3D Thermal/Flow, Simcenter 3D 2021.1 Series
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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/id629496 · retrieved 2026-07-17