Printed Circuit Board

Video: Perform a thermal analysis on a component and printed circuit board

Use a Printed Circuit Board simulation object to identify regions of faces or elements as a printed circuit board.

The faces or elements of the printed circuit board (1) convect:

• From both sides in embedded fluid volumes where there is no PCB component (2). The solver uses the thickness (3) that you define on the 2D shell to ensure that the 2D mesh convects from both sides.

• Only from the board area that is not covered by a PCB component.

The solver takes the faces selected in PCB Component simulation objects and defines them as obstructions in the internal flow surface created for the Printed Circuit Board simulation object.

To model thermal and flow phenomena on the printed circuit board, you must create the PCB Stack physical property in the FEM in addition to the Printed Circuit Board simulation object. A Printed Circuit Board simulation object is created automatically by the PCB Exchange application when you use the Thermal Solution command.

Where do I find it?

Application	Pre/Post
Command Finder	Printed Circuit Board
Simulation Navigator	Right-click the Simulation Objects node→New Simulation Object→Printed Circuit Board

How do I

Identify a Printed Circuit Board

Learn more

Inputs to expressions

PCB Component

PCB Stack

Look up more details

Auto-generated expressions

Meshing for turbulence modeling

Quick links

Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions

Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal

Command reference

Pre/Post video examples

Bulk Entry Descriptions

Simcenter 3D tutorials

Browse Simcenter 3D help by product area

Related Topics

Thermal Solution

Printed Circuit Board, Simcenter 3D 2021.1 Series

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