PCB Via

Video: Perform a thermal analysis on a component and printed circuit board

Use the PCB Via modeling object to define a linear thermal coupling between two or more layers of a printed circuit board (PCB).

You can use the PCB Via modeling object to model:

• Simplified vias specifying their approximate location.

• Detailed vias from ECAD data that is imported using PCB Exchange.

PCB Via modeling objects may be created automatically by PCB Exchange when you use the Create ESC Solution command.

You can define a PCB Via modeling object only from a PCB Stack physical property table.

In the PCB Via dialog box, you specify:

• The PCB layer from which the PCB via starts.

• The PCB layer to which the PCB via extends.

• The PCB via material.

• The coverage of the vias with respect to the PCB area. The coverage can be a value between 0 and 1 or a spatial field.

Where do I find it?

Application	Pre/Post
Command Finder	Physical Properties →PCB Stack→Create
Menu	Insert→Physical Properties→Printed Circuit Board→Create
Simulation Navigator	Right-click the 2D mesh collector node →Edit→Type list→PCB Stack→PCB Property row→Edit or Create Physical
Location in dialog box	Vias Definition tab→Create

How do I

Create a printed circuit board stack

Learn more

PCB Stack

PCB Layer

Editing the attributes of multiple PCB layers and vias

Printed Circuit Board

Quick links

Command reference

Pre/Post video examples

Bulk Entry Descriptions

Simcenter 3D tutorials

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Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions

Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal

Related Topics

Thermal Solution

PCB Via, Simcenter 3D 2021.1 Series

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