Meshing > Meshing for Simcenter 3D Thermal/Flow, Electronic Systems Cooling, Space Systems Thermal
Thermal meshing
A thermal model consists of elements to model conduction, radiation, and simple convection.
This section describes how to build a mesh for these thermal objects.
Conduction occurs whenever thermal elements share nodes.
Conduction can be modeled using 3D, 2D, 1D, and 0D element types. You can model complex geometry combined with many different element types and material types, both isotropic and orthotropic.
Since the thermal solver uses a control volume approach, there is no need to refine the mesh at the interface between different materials. However, some care must be taken when meshing between different element types, as detailed in Special considerations for thermal meshing.
Conduction modeling
Because the thermal solver uses a control volume formulation for the solution, the element's nodes are used only to define the element's geometry. The nodes do not become calculation points in the numerical thermal model as they do with the finite element method.
A calculation point is established at each element's center of gravity. In addition:
For a 3D element, an additional calculation point is added at the midpoint of each 2D face of the element
For a 2D element, an additional calculation point is added at the midpoint of each 1D edge of the element.
| Element | ||
|---|---|---|
| Element center of gravity and calculation point | ||
| Conductances | ||
| Node | ||
| Additional boundary calculation points |
A conductance is established using an algorithm which constrains a piecewise-linear element temperature function to satisfy the governing Partial Differential Equation (PDE) for conduction.
The centroidal node is used to compute distributed heat transfer (radiation, convection, and heat flux). Its temperature is computed assuming a piecewise-linear temperature distribution in the element.
A boundary condition in the thermal solver is applied at the calculation point at the element's center of gravity (CG).
For example, if you specify a fixed temperature for an element, you are actually fixing the temperature at the CG of the element, and not the temperature of the entire element.
The heat flow into the centroidal node is distributed to the boundary calculation points. The thermal solver interpolates the temperature results from the calculation points to the element nodes for post processing and the CG temperature is kept as the element temperature.
How do I
Create a primitive
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Fluid meshing
Immersed boundary meshing
Duct network meshing
Primitives for Simcenter 3D Space Systems Thermal
Axisymmetric thermal modeling in non-axisymmetric solutions
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Meshing for Simcenter 3D Thermal/Flow, Electronic Systems Cooling, Space Systems Thermal
Special considerations for thermal meshing
Working with multi-layer shell elements
Geometry creation for body-fitted fluid meshing
Geometry preparation for immersed boundary method
Defining the mesh size for fluid modeling
Node to geometry matching in large dimension models
Meshing for turbulence modeling
Meshing consideration and wall functions
Thermal and flow element quality
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Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions
Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal
Thermal meshing, Simcenter 3D 2021.1 Series
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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/id628311 · retrieved 2026-07-17