Simcenter 3D Electronic Systems Cooling

Simcenter 3D Electronic Systems Cooling is a comprehensive solver environment for the simulation of heat transfer and fluid flow in electronic systems and components. It includes all the capabilities that are available in the coupled thermal and flow solvers from the Simcenter 3D Thermal/Flow solver environment. Like Simcenter Nastran, it is fully integrated into the native Pre/Post environment. Teamcenter tools are supported for controlling multiple design iterations and case studies.

Electronic Systems Cooling supports parallel processing of the thermal and flow solvers with access to up to 8 processes per run, on a single machine.

Simcenter 3D Thermal/Flow DMP is an add-on product to Electronic Systems Cooling that removes any software limitations on the number of processes per run for parallel processing and enables parallel solutions over networks and clusters.

In addition to the thermal solver and flow solver features, Electronic Systems Cooling includes the following specialized features:Fan catalogThermostat and active heater controllers for heaters and fansPeltier coolers, Joule heating, and electrical contact resistanceNX PCB Exchange — ECAD/NX associative data exchangeSolar heatingHydraulic duct networksHumidity, condensation, and evaporation modeling

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Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions

Simcenter 3D Electronic Systems Cooling, Simcenter 3D 2021.1 Series

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