Model conduction in a bonded joint

You can easily model conduction across a bonded joint without modeling the bonded material with elements.

1. When you define the Thermal Coupling simulation object, select the primary and secondary elements.

2. Select Conductive Gap from the Type list.

3. Specify the conductivity k of the bonding material in the Gap Thermal Conductivity box in terms of the given units.

4. Ensure that the gap between the primary group and secondary group is modeled correctly.

You enter the conductivity of the bonding material, k. When you solve your model, the software calculates the resulting conductance as G = (k**A)/L.

(A) Chip top face (primary region)

(B) Sink bottom face (secondary region)

(C) Gap distance between the heat chip and heat sink, coupled with the bonding material

How do I

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Thermal Coupling magnitude types

Additional Conductance types

Specifying a Coupling Resolution

Using the Only Connect Overlapping Elements option

Using the Overlap Projection Direction option

Temperature dependency for thermal and electrical couplings

Inputs to expressions

Look up more details

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Perfect Contact options

Auto-generated expressions

Thermal Coupling dialog box

Quick links

Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions

Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal

Command reference

Pre/Post video examples

Bulk Entry Descriptions

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Model conduction in a bonded joint, Simcenter 3D 2021.1 Series

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