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Physical properties and element attributes > Defining physical properties

PCB Stack

Video: Perform a thermal analysis on a component and printed circuit board

Use the PCB Stack physical property to:

  • Model a printed circuit board’s complex in-plane conductivity in each layer and across layers without using 3D solid elements.

  • Model the stack of a Printed Circuit Board (PCB) by defining the layers and the order of the layers. Model each layer by defining its materials and the trace area coverage percentage.

  • Model detailed traces and vias information from ECAD models that are imported using the PCB Exchange application.

  • Calculate and post process a detailed temperature profile in each layer that you define inside the PCB Layer modeling object.

Sample PCB Stack with top and bottom layers

The PCB Stack physical property applies only to 2D mesh collectors.

When you define the stack sequence, the first PCB Layer modeling object corresponds to the bottom layer (Layer 1).

PCB Stack orientation

A PCB Stack physical property contains PCB Layer and PCB Via modeling objects.

Note:

  • You must define one or more PCB Layer modeling objects. A PCB Via modeling object is not required.

To model thermal and flow phenomena on a printed circuit board, you must create a Printed Circuit Board simulation object in addition to the PCB Stack physical property. A PCB Stack physical property is created automatically by PCB Exchange when you use the Thermal Solution command.

Where do I find it?

Application Pre/Post
Command Finder Physical Properties
Location in dialog box TypePCB StackCreate
How do I

Create a printed circuit board stack

Learn more

PCB Layer

Editing the attributes of multiple PCB layers and vias

PCB Via

Printed Circuit Board

Quick links

Command reference

Pre/Post video examples

Bulk Entry Descriptions

Simcenter 3D tutorials

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Simcenter 3D Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal boundary conditions

Thermal/Flow, Electronic Systems Cooling, and Space Systems Thermal

Related Topics

Thermal Solution

PCB Stack, Simcenter 3D 2021.1 Series

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Source: https://docs.sw.siemens.com/en-US/doc/289054037/PL20200601120302950.advanced/id1388317 · retrieved 2026-07-17